Defense Advanced Research Projects AgencyTagged Content List

Harnessing Complexity

Systems comprising multiple and diverse interactions

Showing 8 results for Complexity + Decentralization RSS
In today’s rapidly evolving mission environments, warfighters need new vehicles, weapons and other systems fielded quickly. Current design and development approaches, however, are unable to deliver those systems in a timely manner. To help overcome these challenges, DARPA’s Adaptive Vehicle Make (AVM) portfolio of programs is working to develop revolutionary approaches for the design, testing and manufacturing of complex defense systems, with the goal of shortening development timelines by five times or more. Thanks to strong early test results and a new opportunity to transition the technology, DARPA has decided to speed its current AVM successes to the defense industrial base in 2014—years earlier than originally planned.
As nation-state and non-state adversaries adapt and apply commercially available state-of-the-art technology in urban conflict, expeditionary U.S. forces face a shrinking operational advantage. To address this challenge, a new DARPA program is aiming to create powerful, digital tools for exploring novel expeditionary urban operations concepts—with a special emphasis on coastal cities, where future such battles are deemed most likely to occur. The program will test the new tools and concepts in an integrated virtual environment, with the ultimate goal of developing fluidly composable force packages able to maximize tactical advantage in these complex, urban environments.
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.
July 23-25, 2018,
DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.