Defense Advanced Research Projects AgencyTagged Content List

Harnessing Complexity

Systems comprising multiple and diverse interactions

Showing 7 results for Complexity + Cost RSS
The manufacturing process for defense systems—from aircraft to vehicles to ships—is extremely complex and fragmented, often demanding unique materials and processes, complex certification requirements and specifications, and specialized tools and equipment. The almost inevitable result: lengthy production timelines and high costs. The manufacture of diverse small parts for military systems could be made simpler, faster, and less expensive with the development of a tailorable composite feedstock material and a single tailorable forming method.
With the official roll out of the Electronics Resurgence Initiative’s latest investments today, DARPA hopes to open new innovation pathways to address impending engineering and economics challenges that, if left unanswered, could challenge what has been a relentless half-century run of progress in microelectronics technology. To maintain healthy forward momentum, the ERI over the next four years will commit hundreds of millions of dollars to nurture research in advanced new materials, circuit design tools, and system architectures. In addition to a half-dozen or so existing DARPA programs, and the largest program in the U.S. that funds basic electronics research at universities, 
First announced in June 2017, DARPA’s Electronics Resurgence Initiative (ERI) is a multi-year, upwards of $1.5 billion investment in jumpstarting innovation and collaboration across the U.S. electronics community to address an array of long foreseen challenges to Moore’s Law. To kickoff this community-wide effort, DARPA is hosting its first annual ERI Summit from July 23-25 in San Francisco, CA. The three-day event will bring together leading voices from across the electronics community–including Alphabet, Applied Materials, Intel, Synopsys, Cadence, Mentor Graphics, NVIDIA, and IBM–to address challenges and opportunities for the next half century of electronics progress.
July 23-25, 2018,
DARPA’s Microsystems Technology Office is hosting the first annual Electronics Resurgence Initiative (ERI) Summit. The three-day event will bring together those most impacted by the coming inflection in Moore’s Law, including senior representatives from the commercial sector, defense industrial base, academia, and government, to promote collaboration and cooperation on shaping the future direction of U.S. semiconductor innovation. The event will also highlight progress and opportunities within DARPA’s ERI research programs.
The capabilities and technical specifications required for Department of Defense (DoD) platforms are constantly changing due to unanticipated circumstances, needs and emerging threats. However, complex development and design cycles and the associated high costs of structural design changes for current technologies significantly limit our ability to rapidly and affordably evolve such systems.