Defense Advanced Research Projects AgencyTagged Content List

Communications and Networks

All manner of sending, receiving, connecting and protecting information

Showing 4 results for Communications + Integration RSS
04/25/2018
Only a few decades ago, finding a particular channel on the radio or television meant dialing a knob by hand, making small tweaks and adjustments to hone in on the right signal. Of course, we now take such fine tuning for granted, simply pressing a button to achieve the same effect. This convenience is enabled by radio frequency synthesis, the generation of accurate signal frequencies from a single reference oscillator.
The Direct On-Chip Digital Optical Synthesizer (DODOS) program seeks to create a technological revolution in optical frequency control analogous to the disruptive advances in microwave frequency control in the 1940s. That early development ushered in a new era for microwave technology, transformed modern warfare, and has since been enabling a multitude of Department of Defense (DoD) and civilian capabilities, including radar, navigation technologies, and satellite and terrestrial communications. Extending frequency control to the optical regime is anticipated to greatly extend the technology base for the next generation of warfighter and other capabilities.
Program Manager
Dr. James Wilson joined DARPA in July 2020 as a program manager in the Microsystems Technology Office (MTO). His research interests include the development of radio frequency (RF), analog, and digital circuits that push the power and performance envelope; novel topologies enabled through heterogeneous integration; and the applications of electronics to enable new RF, EW, and communication opportunities. He is particularly interested in increasing the energy efficiency of electronics to enable ubiquitous, high performance systems for wideband electromagnetic spectrum operations.
Program Manager
Dr. Thomas E. Kazior joined DARPA in July 2020 as a program manager in the Microsystems Technology Office (MTO). His research interests include semiconductor device design, fabrication and integration processes including 3D heterogeneous integration (HI) of silicon and compound semiconductor and other non-silicon devices for RF arrays, and microwave/millimeter-wave/sub-millimeter-wave devices for sensors and communications.