Dr. Timothy M. Hancock joined DARPA as a program manager in September 2016. His research interests revolve around RF microsystem development that spans semiconductor device processing, circuit design and system integration for communication, radar, and electromagnetic spectrum- sensing applications.
Dr. Hancock is serving DARPA while on leave from MIT Lincoln Laboratory. For the past five years, he was an assistant group leader in the RF Technology Group were he led programs in RF system design, RF & mixed-signal integrated circuit design in CMOS and SiGe processes, and material and device development for next-generation RF GaN-on-Si and emerging ultra-wide bandgap semiconductors. In his first seven years as a staff member at Lincoln Laboratory, he worked on many programs in which he developed low-power wireless devices for a variety of applications and several multiple-input, multiple-output (MIMO) communication systems.
Dr. Hancock has published more than 20 papers and is a senior member of the IEEE, where he recently completed 10 years of service on the technical program committee for the Radio Frequency Integrated Circuits (RFIC) Symposium and is a reviewer for multiple MTT-S and SSCS publications. In 2010 he was the inaugural recipient of the MIT Lincoln Laboratory Early Career Technical Achievement Award.
Dr. Hancock earned a B.S. degree in electrical engineering from the Rose-Hulman Institute of Technology and M.S. and Ph.D. degrees in electrical engineering from the University of Michigan where his graduate work focused on RF Integrated Circuit design techniques in SiGe for 24 GHz automotive radar applications.
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