Dr. Timothy M. Hancock joined DARPA as a program manager in September 2016. His research interests revolve around RF microsystem development that spans semiconductor device processing, circuit design and system integration for communication, radar, and electromagnetic spectrum-sensing applications. He is particularly interested in new circuit architectures and the underlying technology development to improve the dynamic range of RF receivers and transmitters in the face of increasing bandwidth to support wideband electromagnetic spectrum operations.
Prior to joining DARPA, Hancock was at MIT Lincoln Laboratory where he was an assistant group leader in the RF Technology Group. He led programs in RF system design, RF and mixed signal integrated circuit design in CMOS and SiGe, as well as material and device development for next generation RF GaN-on-Si and emerging ultra-wide bandgap semiconductors. As a staff member at Lincoln Laboratory, Hancock worked on multiple programs where he developed low-power wireless devices for sensing and communication applications and several multiple-input, multiple-output (MIMO) communication systems for protected special communication.
Hancock has published more than 25 papers and is a senior member of the IEEE, where he served for 10 years on the technical program committee for the Radio Frequency Integrated Circuits (RFIC) Symposium. Also, he was part of the steering committee for the International Microwave Symposium (IMS) in 2009 and 2019 in Boston. In 2010, he was the inaugural recipient of the MIT Lincoln Laboratory Early Career Technical Achievement Award for his work on small form-factor RF systems and MIMO communications systems.
Hancock earned a Bachelor’s of Science degree in electrical engineering from the Rose-Hulman Institute of Technology and master’s and doctoral degrees in electrical engineering from the University of Michigan, where his graduate work focused on RF integrated circuit design techniques in SiGe for 24 GHz automotive radar applications.
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