NGMM Summit

The Microsystems Technology Office (MTO) will host the Next-Generation Microelectronics Manufacturing (NGMM) Summit on Oct. 27–28, 2025, in Austin, Texas.

This inaugural event will bring together stakeholders from across defense, academia, industry, and the broader microelectronics ecosystem to explore the vision, progress, and opportunities of the NGMM program.

NGMM is a cornerstone of DARPA’s efforts to push beyond the current state-of-the-art and sustain long-term U.S. leadership in microelectronics. The program leverages three-dimensional heterogeneous integration (3DHI) of mixed materials to overcome the constraints of traditional silicon-based systems. 

In partnership with the University of Texas at Austin and its Texas Institute for Electronics (TIE), DARPA is establishing the first centralized, domestic, open-access prototyping and pilot production facility for 3DHI technologies.

Highlights of the NGMM Summit include:

• Working with NGMM: Insights into early customer and partner engagement, the program’s timeline, and opportunities to participate in 3DHI research, development, and prototyping.
• Technology roadmap: A deep dive into NGMM’s 3DHI integration strategy, including design methodologies and development infrastructure.
• Progress in action: Updates on facility build-out, tool installation, and progress toward key process development goals.

This event will be held at the Unclassified level.

Advance registration is required. Registration is open until Oct. 6, 2025.

Further details, including registration information, can be found at the event website. For questions, please email NGMM_Summit@darpa.mil.