Ctrl-P to Print
Active Cooling Modules (ACM)
Frequently Asked Questions
Q: What are the applications for the cooler you are interested in?
A: There is no single specific application. We are thinking generally of the problems of cooling high-power electronic power devices, such as microprocessors, power converters, amplifiers, etc.
Q: On page six of DARPA BAA 09-44, it is stated that conventional PbTe materials have been used for cooling applications; is this a mistake and Bi 2 Te 3 materials were intended?
A: Yes, this was a typo. The conventional materials that we are referring to in this BAA are the bismuth telluride materials used in commercial TE coolers.
Q: If we are not sure about some of the aspects of our team or our ideas, should we submit a Proposal Abstract anyway?
A: Yes, the Proposal Abstract will lead to our BAA review team reviewing all the information that you do provide, and there will be feedback on information you do provide.
Q: The DARPA BAA 09-44 refers to the "Hot Side" and "Cold Side" of the cooler in several locations, but the temperatures may depend on the operation of the system; can you clarify?
A: Yes, sorry about the confusion. In the descriptions of the metrics in the BAA, the "Hot Side" of the ACM is the side that the electronic device is mounted on, as shown in Figure 4, and the "Cold Side" is the side mounted on the spreader and heat sink.
Q: Can we assume that the electronic device power distribution is uniform?
A: Yes, assume 100W over 2cm x 2cm.
Q: What other information is available that would help us prepare a good Proposal?
A: There is no other official information. Our best advices for preparing a good proposal is to re-read page 10 of the BAA and submit an abstract that includes a good description of your idea and all the aspects of your plan that you would like feedback on.
Q: What are the heat rejection performance key limitations for the applications that you are concerned about?
A: For this BAA, the requirements that are critical are those described in DARPA BAA 09-44 only. We are interested in improved COP for high-flux coolers.
Q: Are you looking for a new design of a complete cooling system as opposed to improvement of a particular component of an existing one?
A: For this BAA we are looking for only what the metrics of the BAA are directed towards; all Proposals will be scored against these metrics. We are simply looking for a cooling module that meets the performance metrics of those listed in DARPA BAA 09-44.
Q: What thermal resistance should we assume from the ACM hot side to ambient?
A: Please assume that the device temperature + the "Delta T" determines the temperature on the heat sink side of the structure, and that there is a thermal management system from this point onward that can deliver the Device Power + Cooler Power to the Ambient while maintaining the temperature on the heat sink side. We are not going to specify thermal resistance and ambient for this program, as those might vary from one application to another. For testing, it will be the responsibility of the performer to construct a test setup that can create the conditions specified in DARPA BAA 09-44.
Q: Do we need to meet the metrics during thermal cycles or only after?
A: After.
Q: Does the procurement Integrity Act apply?
A: Yes.
Q: Is an ACM that requires external drive electronics acceptable?
A: The external drive is OK, but if there is a need for conversion to something exotic (really high voltage or frequencies), it may be viewed as a disadvantage. If the conversion is likely to be inefficient, the efficiency has to be included in the COP. A Proposal Abstract is the best way to get specific feedback on an idea like this.
Q: Will all awards resulting from DARPA BAA 09-44 be subject to the Indirect Cost Cap included in the first paragraph of page 25? (i.e. does DARPA anticipate using 6.1 Basic Research Funding to fund these awards?)
A: DARPA anticipates Proposals which intend to perform fundamental research, i.e., basic and applied research in science and engineering. The type of funding will be determined based upon the Proposals received and selected for funding.
Q: Could you please provide guidance with regards to the expected range of duration and funding levels for each of the Phases I, II, and III for this solicitation?
A: Guidance for phase length and duration can be found in the DARPA BAA 09-44 on page 9 under program scope. The ACM program will consist of three phases; the length of each phase is determined by the proposer. Further information can be found on page 9 of the DARPA BAA 09-44. As for funding levels, DARPA does not provide this information for BAA's.