Diverse Accessible Heterogeneous Integration (DAHI)

Program Objective

Complex Defense systems, such as RADAR, communications, imaging and sensing systems rely on a wide variety of microsystems devices and materials.
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Compound Semiconductor Materials on Silicon

Radio Frequency and mixed signal electronics face performance limitations due to the limited circuit complexity possible in typical high-speed/high-dynamic-range compound semiconductor integrated circuit technologies.
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Electronic-Photonic Heterogeneous Integration (E-PHI)

High performance optoelectronic systems, e.g. ultra low-noise lasers and optoelectronic signal sources, are employed in numerous applications such as fiber optic communications, high-precision timing references, LADAR, imaging arrays, etc.
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DAHI Foundry Technology

The DAHI Foundry Technology program thrust seeks to establish an accessible, manufacturable technology for device-level heterogeneous integration of a wide array of materials and devices (including, for example, multiple electronics and MEMS technologies) with complex silicon-enabled (e.g. CMOS) architectures on a common silicon substrate.
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