Effective and secure manufacturing techniques remain a priority for the DoD. With the ever-increasing globalization of the electronics industry, the risk in proliferation of counterfeit ICs in the marketplace, as well as the potential for the introduction of malicious circuits into a design, is of concern. MTO seeks to develop techniques that will provide system developers the ability to determine the function of digital, analog and mixed-signal ICs non-destructively. Additionally, the office seeks revolutionary circuit design methodologies combined with hybrid lithography tools to enable cost-effective, low-volume fabrication of application specific integrated circuits (ASICs) for DoD applications.